• DocumentCode
    723255
  • Title

    Analysis of measurement reliability of hot-film air flow sensor influenced by air contaminant

  • Author

    Chunlin Xu ; Xing Guo ; Hao Jiang ; Sheng Liu ; Wan Cao

  • Author_Institution
    Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    2270
  • Lastpage
    2276
  • Abstract
    In this paper, the analysis of air contaminant´s influence on the measurement reliability of hot-film air flow sensor is presented. Modeling of the particles´ motion states and the temperature distribution of the sensor using ANSYS Workbench´s Fluent module are carried out. The structure details of the flow sensor chip is included in the finite element model for computing. The temperature distribution of the sensor chip with respect to the flow rate of air with the air contaminant ignored is analyzed at first. Then the flow field of the sensor chip with air contaminant in consideration is simulated in order to analyze the motion states of the air contaminant. The particle diameter of the dusts and the air contaminant´s content in the air are the two key parameters involved when analyzing the air contaminant´s influence on the temperature distribution of the sensor chip. By comparing the temperature difference obtained by igoring the air contaminant with temperature difference obtained by considering the air contaminant, the air contaminant´s influence on the output of the sensor chip is studied.
  • Keywords
    diameter measurement; dust; finite element analysis; flow measurement; flow sensors; motion measurement; reliability; temperature distribution; temperature measurement; thin film sensors; ANSYS Workbench Fluent module; air contaminant; finite element model; hot-film air flow sensor; measurement reliability analysis; particle dust diameter; particle motion state modeling; temperature distribution; Atmospheric modeling; Heating; Pollution measurement; Temperature distribution; Temperature measurement; Temperature sensors; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159920
  • Filename
    7159920