• DocumentCode
    723516
  • Title

    Integration of commercial microspeakers in an acoustic absorbing liner

  • Author

    Houdouin, Alexandre ; Martincic, Emile ; Lefeuvre, Elie ; Durand, Stephane ; Yaakoubi, Nourdin ; Auregan, Yves

  • Author_Institution
    Inst. d´Electron. Fondamentale, Univ. Paris Sud, Orsay, France
  • fYear
    2015
  • fDate
    27-30 April 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this work, the fabrication of an acoustic sound absorbing surface (i.e. liner) made of commercial Visaton™ K16 microspeakers is presented. The acoustic liner is made of a circular surface composed of a 10 cm diameter fix support with 7 embedded microspeakers covering 8.5% of th overall surface. Different electrical connections of the microspeakers using no added electronic circuit are tested and the obtained absorption coefficient is 0.2 close to the natural resonance frequency of the microspeakers. A Negative Impedance Converter is used to electrically compensate the losses occurring in the acoustic liner. The maximum sound absorption is raised to 0.31 using the NIC again close to the natural resonance frequency of the microspeakers with a 7 microspeakers configuration covering 8.5% of the wall surface. The back cavity of the microspeakers is found to slightly move the maximum absorption peak but not to modify the maximum absorption. The influence of the microspeakers density is measured in open circuit configuration. The surface covered by the microspeakers ranges from 2.85% up to 12.35% of the wall surface. The maximum sound absorption ranges then from 0.1 to 0.34.
  • Keywords
    loudspeakers; micromechanical devices; negative impedance convertors; acoustic absorbing liner; acoustic sound absorbing surface; commercial microspeaker; embedded microspeakers; maximum sound absorption; natural resonance frequency; negative impedance converter; size 10 cm; Absorption; Cavity resonators; Fluids; Frequency conversion; Micromechanical devices; Silicon; Microspeaker; Noise absorption;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
  • Conference_Location
    Montpellier
  • Print_ISBN
    978-1-4799-8627-9
  • Type

    conf

  • DOI
    10.1109/DTIP.2015.7160965
  • Filename
    7160965