• DocumentCode
    72415
  • Title

    Foreword: Special Section on RF, 3-D-ICs and Interconnects

  • Author

    Achar, Ramachandra ; Maffucci, A.

  • Author_Institution
    EPEPS 2011 and EPEPS 2012,
  • Volume
    3
  • Issue
    11
  • fYear
    2013
  • fDate
    Nov. 2013
  • Firstpage
    1889
  • Lastpage
    1890
  • Abstract
    The seven papers in this special section are updated and expanded versions of the papers that appeared in the IEEE CPMT-sponsored conferences: Electrical Performance of Electronic Packaging and Systems (EPEPS) 2011 and 2012, and Workshop on Signal and Power Integrity (SPI) 2011 and 2012.
  • Keywords
    Integrated circuit interconnections; Integrated circuit modeling; Meetings; Special issues and sections; Through-silicon vias;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2286712
  • Filename
    6650009
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=72415