Advanced contamination control methods for yield enhancement

Semiconductor manufacturing is a highly complex process, with a high need for process control, but equally important are effective methods for contamination control during and after the processes. Methods for detection of airborne and surface molecular contaminants were developed to meet the challenging requirements for More Moore and More than Moore applications. Qualitative and quantitative contamination analysis of organic and inorganic compounds allows monitoring of contamination in front- as well as back-end processes. In this way, cross contaminations including precious metals, e.g. Au, Ag, Pd, organic and inorganic compounds e.g. sulfur, fluorine can be avoided. By the use of state-of-the-art analytical systems, a contamination control for any cleanroom and all wafer sizes could be implemented.