DocumentCode
725197
Title
75–110 GHz integrated active sextupler module
Author
Zhenhua Chen ; Yu Bing ; Yong Zhou ; Fayu Wan ; Junxiang Ge
Author_Institution
Jiangsu Key Lab. of Meteorol. Obs. & Inf. Process., Nanjing Univ. of Inf. Sci. & Technol., Nanjing, China
fYear
2015
fDate
March 30 2015-April 1 2015
Firstpage
1
Lastpage
4
Abstract
An integrated active sextupler module covering 75-110 GHz is developed and described in this paper. Discrete Schottky devices, commercial MMICs and self-designed passive circuits are included in this module. Multi-chip packaging technology is adopted to greatly simplify inter-stage interconnection, so the characteristics of compact and high reliability are achieved. In the aspect of circuit topology, considering the performance of each device and circuit, an technical route of frequency multiplying - pre-amplifying - power dividing - driving amplifying - frequency multiplying - power amplifying - power combining is chosen. Inconsistency between the final-stage PA MMICs is solved. Finally, the following results have been achieved: while pumped with 0 dBm input signal in the range of 12.5-18.4 GHz, output signal with a typical power of 14 dBm can be produced over the 75-110 GHz band. This performance is comparable to the foreign commercial products.
Keywords
MMIC; power dividers; MMIC; circuit topology; discrete Schottky devices; driving amplifying; frequency 75 GHz to 110 GHz; frequency multiplying; integrated active sextupler module; interstage interconnection; multichip packaging technology; power amplifying; power combining; power dividing; pre-amplifying; self-designed passive circuits; Broadband communication; Impedance matching; MMICs; Microstrip; Power amplifiers; Power generation; Scattering parameters; W-band; integrated; solid-state frequency multiplier source;
fLanguage
English
Publisher
ieee
Conference_Titel
Wireless Symposium (IWS), 2015 IEEE International
Conference_Location
Shenzhen
Type
conf
DOI
10.1109/IEEE-IWS.2015.7164585
Filename
7164585
Link To Document