• DocumentCode
    725197
  • Title

    75–110 GHz integrated active sextupler module

  • Author

    Zhenhua Chen ; Yu Bing ; Yong Zhou ; Fayu Wan ; Junxiang Ge

  • Author_Institution
    Jiangsu Key Lab. of Meteorol. Obs. & Inf. Process., Nanjing Univ. of Inf. Sci. & Technol., Nanjing, China
  • fYear
    2015
  • fDate
    March 30 2015-April 1 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    An integrated active sextupler module covering 75-110 GHz is developed and described in this paper. Discrete Schottky devices, commercial MMICs and self-designed passive circuits are included in this module. Multi-chip packaging technology is adopted to greatly simplify inter-stage interconnection, so the characteristics of compact and high reliability are achieved. In the aspect of circuit topology, considering the performance of each device and circuit, an technical route of frequency multiplying - pre-amplifying - power dividing - driving amplifying - frequency multiplying - power amplifying - power combining is chosen. Inconsistency between the final-stage PA MMICs is solved. Finally, the following results have been achieved: while pumped with 0 dBm input signal in the range of 12.5-18.4 GHz, output signal with a typical power of 14 dBm can be produced over the 75-110 GHz band. This performance is comparable to the foreign commercial products.
  • Keywords
    MMIC; power dividers; MMIC; circuit topology; discrete Schottky devices; driving amplifying; frequency 75 GHz to 110 GHz; frequency multiplying; integrated active sextupler module; interstage interconnection; multichip packaging technology; power amplifying; power combining; power dividing; pre-amplifying; self-designed passive circuits; Broadband communication; Impedance matching; MMICs; Microstrip; Power amplifiers; Power generation; Scattering parameters; W-band; integrated; solid-state frequency multiplier source;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wireless Symposium (IWS), 2015 IEEE International
  • Conference_Location
    Shenzhen
  • Type

    conf

  • DOI
    10.1109/IEEE-IWS.2015.7164585
  • Filename
    7164585