Title :
Relay effects in multiple-node Resonant Inductive Coupling Wireless Power Transfer systems
Author :
Bou, Elisenda ; Sedwick, Raymond ; Alarcon, Eduard
Author_Institution :
Electron. Eng. Dept., UPC BarcelonaTech, Barcelona, Spain
Abstract :
Resonant Inductive Coupling Wireless Power Transfer is a key technology to provide an efficient and harmless wireless energy channel to consumer electronics, biomedical implants and wireless sensor networks. However, current applications are limited to point-to-point links and do not explore the capabilities of Multi-Node Resonant Inductive Coupling Wireless Power Transfer Systems. In such a system, the multi-path relaying effect between different nodes could effectively improve the performance of the link in terms of power transferred to the load and power transfer efficiency. However, depending on the impedance and resonant frequency of the nodes that generate the multi-path effect, these nodes could also act as interfering objects, therefore a) making the transmitter and/or receiver act as a pass-band filter and b) loosing part of the transmitter magnetic field through coupling to the interfering node. In this article, a circuit-based analytical model that predicts the behavior of a Multi-Node Resonant Inductive Coupling link is proposed and used to perform a design-space exploration of the multi-path relaying effect in RIC Wireless Power Transfer Systems.
Keywords :
electric current; electromagnetic coupling; inductive power transmission; magnetic resonance; RIC wireless power transfer systems; Relay Effects; biomedical implants; circuit-based analytical model; current applications; design-space exploration; harmless wireless energy channel; interfering node; multipath relaying effect; multiplenode resonant inductive coupling wireless power transfer systems; pass-band filter; point-to-point links; power transfer efficiency; resonant frequency; transmitter magnetic field; Couplings; Impedance; Receivers; Relays; Resistance; Resonant frequency; Transmitters;
Conference_Titel :
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location :
Lisbon
DOI :
10.1109/ISCAS.2015.7168727