DocumentCode
727031
Title
Scalability analysis of SIMO non-radiative resonant wireless power transfer systems based on circuit models
Author
Bou, Elisenda ; Sedwick, Raymond ; Alarcon, Eduard
Author_Institution
Electron. Eng. Dept., UPC BarcelonaTech., Barcelona, Spain
fYear
2015
fDate
24-27 May 2015
Firstpage
694
Lastpage
697
Abstract
Resonant Inductive Coupling Wireless Power Transfer is a leading field of research due to the growing number of applications that can benefit from this technology: from biomedical implants to consumer electronics, fractionated spacecraft and electric vehicles, amongst others. However, applications are currently limited to point-to-point-links and do not target Single Input - Multiple Output (SIMO) scenarios. New challenges and applications of Resonant Non-Radiative Wireless Power Transfer emphasize the necessity to explore, predict and assess the behavior of RIC-WPT in SIMO links. Moreover, new systemlevel metrics have to be derived to study the scalability of SIMO Wireless Power Transfer applications and to provide design guidelines for these systems. In this article a Single Input - Multiple Output RIC-WPT System is modeled analytically from a circuit-centric point of view and validated using a Finite Element Field Solver (FEKO). The analytical model and associated closed formulation is finally used to derive system-level metrics to predict the behavior and scalability of RIC SIMO Systems and the results are showcased for an assymetric SIMO scenario.
Keywords
finite element analysis; inductive power transmission; integrated circuit modelling; FEKO; RIC-WPT system; SIMO nonradiative resonant wireless power transfer systems; circuit models; finite element field solver; point-to-point-links; resonant inductive coupling wireless power transfer system; scalability analysis; single input-multiple output scenarios; system-level metrics; Analytical models; Couplings; Finite element analysis; Measurement; Receivers; Transmitters; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location
Lisbon
Type
conf
DOI
10.1109/ISCAS.2015.7168728
Filename
7168728
Link To Document