High temperature electronics packaging: An overview of substrates for high temperature

High temperature electronics (>200 °C) is an emerging technical area in electronics that requires new materials and processes or existing materials and processes in new ways. Results of reliability testing of packaging materials for >200 °C are presented so that the selection of appropriate packaging may be made to target an applications temperature and lifetime requirements. Polymer and ceramic substrates are compared using experimental testing. Lifetime comparisons at 200C for polymer substrates and limitations due to composition are made. Thick film alumina, Low Temperature Co-fired Ceramic, and thin film AlN substrate qualification test results and limitations in material selection are presented.