• DocumentCode
    727141
  • Title

    A body-biasing of readout circuit for STT-RAM with improved thermal reliability

  • Author

    Lun Yang ; Yuanqing Cheng ; Yuhao Wang ; Hao Yu ; Weisheng Zhao ; Todri-Sanial, Aida

  • Author_Institution
    Sch. of Mathmatics & Syst. Sci., Beihang Univ., Beijing, China
  • fYear
    2015
  • fDate
    24-27 May 2015
  • Firstpage
    1530
  • Lastpage
    1533
  • Abstract
    As the integration density rockets up for contemporary VLSI circuits, power consumption limits the scalability of technology advancement of CMOS. Spin transfer torque-magnetic random access memory (STT-MRAM), as one of the emerging non-CMOS technologies, has the promising prospect of low standby power, fast access speed and compatibility with the CMOS fabrication process. However, with the technology node scaling down, typical 1 Transistor-1 Magnetic Tunnel Junction (1T-1MTJ) STT-RAM cell suffers from severe reliability challenges, especially for read operation under temperature fluctuation. In this paper, we quantitatively analyze the temperature effect on read reliability of STT-RAM cell and propose a novel body-biasing feedback readout circuit design to improve the read sensing margin under different temperatures. The experiments based on 40nm CMOS technology and MTJ compact model validate the effectiveness of the proposed method. The improved sensing margin also permits a smaller sensing current for reading such that higher read energy efficiency can be achieved.
  • Keywords
    CMOS integrated circuits; MRAM devices; integrated circuit reliability; magnetic tunnelling; readout electronics; 1 transistor-1 magnetic tunnel junction STT-RAM cell; 1T-1MTJ STT-RAM cell; CMOS fabrication process; CMOS technology; MTJ compact model; STT-MRAM; body-biasing feedback readout circuit design; contemporary VLSI circuits; integration density; power consumption; read energy efficiency; read operation; read reliability; read sensing margin; spin transfer torque-magnetic random access memory; temperature effect; temperature fluctuation; Integrated circuit reliability; Magnetic tunneling; Temperature distribution; Temperature sensors; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
  • Conference_Location
    Lisbon
  • Type

    conf

  • DOI
    10.1109/ISCAS.2015.7168937
  • Filename
    7168937