DocumentCode :
727141
Title :
A body-biasing of readout circuit for STT-RAM with improved thermal reliability
Author :
Lun Yang ; Yuanqing Cheng ; Yuhao Wang ; Hao Yu ; Weisheng Zhao ; Todri-Sanial, Aida
Author_Institution :
Sch. of Mathmatics & Syst. Sci., Beihang Univ., Beijing, China
fYear :
2015
fDate :
24-27 May 2015
Firstpage :
1530
Lastpage :
1533
Abstract :
As the integration density rockets up for contemporary VLSI circuits, power consumption limits the scalability of technology advancement of CMOS. Spin transfer torque-magnetic random access memory (STT-MRAM), as one of the emerging non-CMOS technologies, has the promising prospect of low standby power, fast access speed and compatibility with the CMOS fabrication process. However, with the technology node scaling down, typical 1 Transistor-1 Magnetic Tunnel Junction (1T-1MTJ) STT-RAM cell suffers from severe reliability challenges, especially for read operation under temperature fluctuation. In this paper, we quantitatively analyze the temperature effect on read reliability of STT-RAM cell and propose a novel body-biasing feedback readout circuit design to improve the read sensing margin under different temperatures. The experiments based on 40nm CMOS technology and MTJ compact model validate the effectiveness of the proposed method. The improved sensing margin also permits a smaller sensing current for reading such that higher read energy efficiency can be achieved.
Keywords :
CMOS integrated circuits; MRAM devices; integrated circuit reliability; magnetic tunnelling; readout electronics; 1 transistor-1 magnetic tunnel junction STT-RAM cell; 1T-1MTJ STT-RAM cell; CMOS fabrication process; CMOS technology; MTJ compact model; STT-MRAM; body-biasing feedback readout circuit design; contemporary VLSI circuits; integration density; power consumption; read energy efficiency; read operation; read reliability; read sensing margin; spin transfer torque-magnetic random access memory; temperature effect; temperature fluctuation; Integrated circuit reliability; Magnetic tunneling; Temperature distribution; Temperature sensors; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location :
Lisbon
Type :
conf
DOI :
10.1109/ISCAS.2015.7168937
Filename :
7168937
Link To Document :
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