Title :
Inductive coupling effects in large TSV arrays
Author :
Kan Xu ; Friedman, Eby G.
Abstract :
The effects of inductive coupling among TSVs within large TSV arrays are investigated in this paper. A comparison of the equivalent inductance of a paired TSV model and arrayed TSV macromodel is presented for three TSV distribution topologies, grouped, lined, and uniform, within the power network. Modified closed-form expressions are proposed to determine the equivalent inductance of a TSV in these large TSV arrays. Simulation results show that this method achieves hundred times speed improvement as compared to an electromagnetic field solver while maintaining accuracy within 7%.
Keywords :
electromagnetic induction; electromagnetic interference; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; three-dimensional integrated circuits; TSV distribution topology; TSV macromodel; equivalent inductance; inductive coupling effect; large TSV arrays; modified closed form expressions; Couplings; Inductance; Integrated circuit modeling; Network topology; Solid modeling; Through-silicon vias; Topology; 3-D integrated circuits (3-D ICs); equivalent inductance; inductive coupling; through slilicon vias (TSVs);
Conference_Titel :
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location :
Lisbon
DOI :
10.1109/ISCAS.2015.7169290
