Inductive coupling effects in large TSV arrays

Author

Kan Xu ; Friedman, Eby G.

fYear

2015

fDate

24-27 May 2015

Firstpage

2888

Lastpage

2891

Abstract

The effects of inductive coupling among TSVs within large TSV arrays are investigated in this paper. A comparison of the equivalent inductance of a paired TSV model and arrayed TSV macromodel is presented for three TSV distribution topologies, grouped, lined, and uniform, within the power network. Modified closed-form expressions are proposed to determine the equivalent inductance of a TSV in these large TSV arrays. Simulation results show that this method achieves hundred times speed improvement as compared to an electromagnetic field solver while maintaining accuracy within 7%.

Keywords

electromagnetic induction; electromagnetic interference; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; three-dimensional integrated circuits; TSV distribution topology; TSV macromodel; equivalent inductance; inductive coupling effect; large TSV arrays; modified closed form expressions; Couplings; Inductance; Integrated circuit modeling; Network topology; Solid modeling; Through-silicon vias; Topology; 3-D integrated circuits (3-D ICs); equivalent inductance; inductive coupling; through slilicon vias (TSVs);

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (ISCAS), 2015 IEEE International Symposium on

Conference_Location

Lisbon

Type

conf

DOI

10.1109/ISCAS.2015.7169290

Filename

7169290