Title :
Low-Temperature Deposition of Co/Pt Film with High-Perpendicular Magnetic Anisotropy by Layer Stacking Sputtering
Author :
Honda, N. ; Tsuchiya, T. ; Saito, S. ; Uchida, H. ; Yamakawa, K.
Author_Institution :
Grad. Sch. of Eng., Tohoku Inst. of Technol., Sendai, Japan
Abstract :
Low-temperature preparation of a Co/Pt layer-stacked film with high-magnetic anisotropy was studied using collimated sputter deposition. Only a trace superlattice line, corresponding to the L11-ordered phase of CoPt, was observed in the X-ray diffraction pattern. However, magnetic properties, exhibited high-saturation magnetization of about 1000 emu/cm3 and large perpendicular magnetic anisotropy, even when the film was deposited at room temperature. For room-temperature deposition, layer-stacked films deposited at a high-Ar pressure of 9.6 Pa exhibited a high coercivity of around 5 kOe and an anisotropy field of around 15 kOe, indicating a high-perpendicular anisotropy of 6.5 × 106 erg/cm3. Deposition at 200 °C increased the anisotropy field up to 20 kOe, indicating a high anisotropy of 1 × 107 erg/cm3. Films deposited without the collimator showed no superlattice line in XRD patterns and exhibited low-saturation magnetization and anisotropy. The cause of the high-perpendicular anisotropy is suggested to be micro ordering in the film.
Keywords :
X-ray diffraction; cobalt; coercive force; magnetic anisotropy; magnetic thin films; platinum; sputter deposition; superlattices; Co-Pt; L11-ordered phase; X-ray diffraction; coercivity; collimated sputter deposition; high-perpendicular magnetic anisotropy; high-saturation magnetization; layer stacking sputtering; low-temperature film deposition; magnetic properties; temperature 200 degC; temperature 293 K to 298 K; trace superlattice line; Anisotropic magnetoresistance; Collimators; Magnetization; Saturation magnetization; Sputtering; Temperature measurement; X-ray scattering; Co/Pt film; collimated sputtering; high-Ar pressure sputtering; high-perpendicular magnetic anisotropy; layer stacking sputter deposition;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2014.2327240