Title :
Transmission-line based modeling for conformal shielding in advance system-in-package (SiP)
Author :
Ching-Huei Chen ; Ying-Cheng Tseng ; I-Chia Lin ; Chieh-Chen Fu ; Kuo-Hsien Liao ; Tzong-Lin Wu
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
In order to efficiently eliminate the noise generated from high-speed integrated circuits, the conformal shielding technology is gradually utilized in advanced System-in-Package (SiP). In this paper, a prediction method based on the transmission-line theory is proposed for evaluating shielding effectiveness (SE) of conformal shielding on SiP. SE measurement of various coating materials is done and presented. By using 4-μm copper, the measured SE successfully demonstrates about 45 dB at the operating frequency of 1 GHz. The proposed model shows a good agreement compared with measured results from 0.01 GHz to 1 GHz.
Keywords :
electromagnetic interference; electromagnetic shielding; SiP; advance system-in-package; coating materials; conformal shielding; conformal shielding technology; electromagnetic interference; evaluating shielding effectiveness; high-speed integrated circuits; prediction method; transmission line based modeling; transmission line theory; Antennas; Copper; Electromagnetic compatibility; Nickel; Semiconductor device measurement; Transmission lines; Vehicles;
Conference_Titel :
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4799-6668-4
DOI :
10.1109/APEMC.2015.7175282