• DocumentCode
    729629
  • Title

    Self-adaptive remote phosphor coating for pc-LEDs packaging by self-exposure slurry method

  • Author

    Qiaolin Lei ; Haibo Rao ; Xuemei Wang ; Da Zhou ; Xianlong Wan ; Linsong Zhou

  • Author_Institution
    Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • fDate
    10-12 Nov. 2013
  • Firstpage
    21
  • Lastpage
    24
  • Abstract
    High efficiency white light-emitting diodes (LEDS) with superior spatial color homogeneity (SCH) have been investigated. In this paper, a new method of packaging of white pc-LEDs that employs a self-exposure technique as well as a remote phosphor configuration is presented. It is suggested that this remote phosphor configuration reduces the backscattering of emission light of LEDs as well as the operating temperature of the phosphor, which improve the efficiency and reliability of white pc-LEDs. The slurry method with self-exposure process was applied to achieve a self-adaptive remote phosphor coating layer surrounding the LED chips which could map the angular intensity distribution of blue light emitted by LED chips and therefore improve the spatial color homogeneity. The experimental results show that the white pc-LEDs with self-adaptive remote phosphor coating has remarkable advantages over conventional dispensing coating and conformal coating in terms of efficiency and color homogeneity.
  • Keywords
    light emitting diodes; phosphors; protective coatings; semiconductor device packaging; semiconductor device reliability; LED chips; angular intensity distribution; blue light; conformal coating; dispensing coating; emission light backscattering; remote phosphor configuration; self-adaptive remote phosphor coating; self-exposure slurry method; spatial color homogeneity; white light emitting diodes; white pc-LED packaging; white pc-LED reliability; Coatings; Color; Lighting; Phosphors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-2249-9
  • Type

    conf

  • DOI
    10.1109/SSLCHINA.2013.7177304
  • Filename
    7177304