Title :
Thermal analysis for silicon-based integration of LED systems
Author :
Mingzhi Dong ; Santagata, Fabio ; Jia Wei ; Yuan, Cadmus ; Kouchi Zhang
Author_Institution :
Beijing Res. Center, Delft Univ. of Technol., Beijing, China
Abstract :
Silicon interposer is an emerging and promising technology for 3D integration of LED systems. In this paper, the thermal performance of silicon interposer is investigated through finite element analysis (FEA). Different approaches of silicon integration are evaluated: double-side interposer and double-layer interposer. The effect of thermal interface material (TIM) on the junction temperature of LEDs is investigated. Some design recommendations are also provided within this paper.
Keywords :
elemental semiconductors; finite element analysis; light emitting diodes; silicon; thermal analysis; 3D integration; LED Systems; Si; double-layer interposer; double-side interposer; finite element analysis; junction temperature; silicon interposer; silicon-based integration; thermal analysis; thermal interface material; thermal performance; Geometry; Integrated circuits; Light emitting diodes; Market research; Reliability; Silicon;
Conference_Titel :
Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-2249-9
DOI :
10.1109/SSLCHINA.2013.7177349
