• DocumentCode
    731576
  • Title

    Lock-in termography for investigation of impact damage in hybrid polypropylene/glass composites: LT to hybrid thermoplastic composites

  • Author

    Boccardi, Simone ; Carlomagno, Giovanni Maria ; Meola, Carosena ; Simeoli, Giorgio ; Acierno, Domenico ; Iannace, Salvatore ; Sorrentino, Luigi ; Russo, Pietro

  • Author_Institution
    Dept. of Ind. Eng., Univ. of Naples Federico II. Naples, Naples, Italy
  • fYear
    2015
  • fDate
    4-5 June 2015
  • Firstpage
    177
  • Lastpage
    181
  • Abstract
    The damage tolerance of multi-layer structures is strongly related to the stacking sequence and the properties of constituent plies. This contribution deals with interlaminar graded interface strength (IGIS) laminated structures, prepared by properly alternating layers of a woven glass fabric with peculiar sequences of compatibilized and not compatibilized polypropylene film layers, symmetrically arranged with respect to the middle plane. The low-velocity impact behaviour of all the laminated structures is investigated at two impact energies (namely 6 and 25 J). Sound and impacted specimens are non-destructively evaluated with lockin thermography (LT). The obtained results show that the impact damaging mode is strongly dependent on the stacking sequence in the IGIS laminate and especially on the type of matrix at the impacted surface.
  • Keywords
    fabrics; impact (mechanical); infrared imaging; IGIS laminated structures; hybrid polypropylene-glass composites; hybrid thermoplastic composites; impact damage; impact damaging mode; interlaminar graded interface strength; laminated structures; lock-in termography; low-velocity impact behaviour; multi-layer structures; polypropylene film layers; stacking sequence; woven glass fabric; Cameras; Films; Glass; Heating; Laminates; Plastics; Stacking; IGIS laminated structures; Impact damage; Lockin thermography; Non.destructive testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Metrology for Aerospace (MetroAeroSpace), 2015 IEEE
  • Conference_Location
    Benevento
  • Type

    conf

  • DOI
    10.1109/MetroAeroSpace.2015.7180649
  • Filename
    7180649