DocumentCode
73170
Title
Investigation of Fixed Oxide Charge and Fin Profile Effects on Bulk FinFET Device Characteristics
Author
Bomsoo Kim ; Dong-Il Bae ; Zeitzoff, Peter ; Xin Sun ; Standaert, Theodorus E. ; Tripathi, N. ; Scholze, A. ; Oldiges, Philip J. ; Dechao Guo ; Huiling Shang ; Kang-Ill Seo
Author_Institution
Samsung Electron., Albany, NY, USA
Volume
34
Issue
12
fYear
2013
fDate
Dec. 2013
Firstpage
1485
Lastpage
1487
Abstract
The effect of positive fixed oxide charge (Qf) on the electrical characteristics of bulk FinFET devices is investigated and newly addressed as a Fin scaling detractor. The aggressively scaled Fin width leads to abnormal subthreshold slope (SS) degradation in nMOS devices even with a long channel length, while pMOS is free of such degradation. This observation is reproduced and analyzed by a well-calibrated TCAD simulation deck with Qf introduced. A new Fin profile suppressing the Qf effect is proposed, and the benefits of the new profile are predicted in terms of variability reduction and mobility improvement, as well as Qf immunity.
Keywords
MOSFET; electron mobility; technology CAD (electronics); Fin profile effects; Fin scaling detractor; Qf immunity; SS degradation; TCAD simulation; abnormal subthreshold slope; bulk FinFET device characteristics; electrical characteristics; long channel length; mobility improvement; nMOS devices; pMOS; positive fixed oxide charge; scaled Fin width; variability reduction; Degradation; Doping; FinFETs; Silicon; Bulk FinFET; fixed oxide charge; low-doped channel doping; mobility improvement; punch-through; random dopant fluctuation; shoulder-shaped Fin cross section; subthreshold degradation; tapered Fin; variability reduction;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2013.2285914
Filename
6650077
Link To Document