• DocumentCode
    73170
  • Title

    Investigation of Fixed Oxide Charge and Fin Profile Effects on Bulk FinFET Device Characteristics

  • Author

    Bomsoo Kim ; Dong-Il Bae ; Zeitzoff, Peter ; Xin Sun ; Standaert, Theodorus E. ; Tripathi, N. ; Scholze, A. ; Oldiges, Philip J. ; Dechao Guo ; Huiling Shang ; Kang-Ill Seo

  • Author_Institution
    Samsung Electron., Albany, NY, USA
  • Volume
    34
  • Issue
    12
  • fYear
    2013
  • fDate
    Dec. 2013
  • Firstpage
    1485
  • Lastpage
    1487
  • Abstract
    The effect of positive fixed oxide charge (Qf) on the electrical characteristics of bulk FinFET devices is investigated and newly addressed as a Fin scaling detractor. The aggressively scaled Fin width leads to abnormal subthreshold slope (SS) degradation in nMOS devices even with a long channel length, while pMOS is free of such degradation. This observation is reproduced and analyzed by a well-calibrated TCAD simulation deck with Qf introduced. A new Fin profile suppressing the Qf effect is proposed, and the benefits of the new profile are predicted in terms of variability reduction and mobility improvement, as well as Qf immunity.
  • Keywords
    MOSFET; electron mobility; technology CAD (electronics); Fin profile effects; Fin scaling detractor; Qf immunity; SS degradation; TCAD simulation; abnormal subthreshold slope; bulk FinFET device characteristics; electrical characteristics; long channel length; mobility improvement; nMOS devices; pMOS; positive fixed oxide charge; scaled Fin width; variability reduction; Degradation; Doping; FinFETs; Silicon; Bulk FinFET; fixed oxide charge; low-doped channel doping; mobility improvement; punch-through; random dopant fluctuation; shoulder-shaped Fin cross section; subthreshold degradation; tapered Fin; variability reduction;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2013.2285914
  • Filename
    6650077