Title :
Design and fabrication of a sandwich framed focal plane array for uncooled infrared imaging
Author :
Zhao, R. ; Ma, W. ; Wang, S. ; Yu, X. ; Feng, Y. ; Zhao, Y.
Author_Institution :
Nat. Key Lab. of Sci. & Technol. on Micro/Nano Fabrication, Peking Univ., Beijing, China
Abstract :
This paper reports a novel infrared (IR) focal plane array (FPA) by using SiNx/SiO2/SiNx sandwich structure as the frames of bimaterial cantilever pixels, and which have sufficient supporting intensity to avoid the fracture and bending of the focal plane. The device was fabricated with a bulk silicon process, where a trench backfill technique was employed to form the SiNx/SiO2/SiNx sandwiched frames. By replacing the silicon frame with SiNx/SiO2/SiNx frame, the fill factor of the FPA is increased to 42%. Meanwhile, the reliability and uniformity of the FPA were improved with a design of staggered arrangement of cantilever pixels. Thermal images of human bodies were captured successfully with the FPA at room temperature.
Keywords :
cantilevers; focal planes; infrared imaging; sandwich structures; silicon compounds; FPA; IR imaging; SiNx-SiO2-SiNx; bending; bimaterial cantilever pixel; bulk silicon process; fracture; sandwich framed focal plane array; temperature 293 K to 298 K; thermal imaging; trench backfill technique; uncooled infrared imaging; Arrays; Fabrication; Gold; Mirrors; Silicon; Silicon compounds; Substrates; Focal plane array (FPA); bimaterial cantilever; infrared imaging; sandwich frame;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
DOI :
10.1109/TRANSDUCERS.2015.7181174
