• DocumentCode
    731897
  • Title

    Compact multifunctional test structure to measure the in-plane thermoelectric figure of merit ZT of thin films

  • Author

    Moser, D. ; Mueller, D. ; Paul, O.

  • Author_Institution
    Dept. of Microsyst. Eng. (IMTEK), Univ. of Freiburg, Freiburg, Germany
  • fYear
    2015
  • fDate
    21-25 June 2015
  • Firstpage
    1322
  • Lastpage
    1325
  • Abstract
    In response to recently renewed interest in thermoelectrics, this paper reports a novel compact, multifunctional test structure to measure the in-plane thermoelectric figure of merit ZT of thin films. All material parameters contributing to ZT = S2-1ρ-1 are determined on a single sample with dimensions of about 500×500 μm2. These are the Seebeck coefficient S, the thermal conductivity κ, and the electrical resistivity ρ. The method can be applied to thin films deposited at high temperature (T), such as poly-Si, and at low T, such as metal layers. We report the temperature-dependent ZT of n-doped poly-Si from 300 to 380 K, as well as the application of the device to Al thin films.
  • Keywords
    Seebeck effect; aluminium; electrical resistivity; elemental semiconductors; metallic thin films; semiconductor thin films; silicon; thermal conductivity; Al; Seebeck coefficient; Si; compact multifunctional test structure; electrical resistivity; in-plane thermoelectric figure of merit; temperature 300 K to 380 K; thermal conductivity; thin films; Conductivity; Fabrication; Films; Heating; Sensors; Temperature measurement; Thermal conductivity; Characterization; Figure of Merit; Poly-Si; Test Structure; Thermoelectric; Thin Film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
  • Conference_Location
    Anchorage, AK
  • Type

    conf

  • DOI
    10.1109/TRANSDUCERS.2015.7181175
  • Filename
    7181175