DocumentCode
732287
Title
A low-cost validation setup for the thermal modelling of electronic devices
Author
Pinciroli, Carlo ; Riahi, Sami ; Beltrame, Giovanni
Author_Institution
Dept. of Comput. Eng., Ecole Polytech. de Montreal, Montreal, QC, Canada
fYear
2015
fDate
7-10 June 2015
Firstpage
1
Lastpage
4
Abstract
Modern integrated circuits generate very high heat fluxes that can lead to a high temperature, degrading the performance and reducing the life time of the device. Thermal simulation is used to prevent this kind of issues, and many models were introduced in recent years. However, their validation is challenging: it is either based on established simulators (with reduced accuracy), or requires to produce a specific test chip with several thermal sensors. In this paper we propose a methodology and measurement setup that uses existing commercial processors to validate thermal models. We use infrared thermography and low-cost thermoelectric cooling, avoiding the issues of mineral oil setups used in previous works. We show how our approach was used to validate two thermal simulators.
Keywords
infrared imaging; microprocessor chips; thermoelectric cooling; commercial processors; electronic devices; heat flux; infrared thermography; integrated circuits; low-cost thermoelectric cooling; low-cost validation setup; measurement setup; mineral oil; specific test chip; thermal modelling; thermal sensors; Cameras; Cooling; Heating; Integrated circuit modeling; Program processors; Temperature distribution; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
New Circuits and Systems Conference (NEWCAS), 2015 IEEE 13th International
Conference_Location
Grenoble
Type
conf
DOI
10.1109/NEWCAS.2015.7182084
Filename
7182084
Link To Document