• DocumentCode
    732287
  • Title

    A low-cost validation setup for the thermal modelling of electronic devices

  • Author

    Pinciroli, Carlo ; Riahi, Sami ; Beltrame, Giovanni

  • Author_Institution
    Dept. of Comput. Eng., Ecole Polytech. de Montreal, Montreal, QC, Canada
  • fYear
    2015
  • fDate
    7-10 June 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Modern integrated circuits generate very high heat fluxes that can lead to a high temperature, degrading the performance and reducing the life time of the device. Thermal simulation is used to prevent this kind of issues, and many models were introduced in recent years. However, their validation is challenging: it is either based on established simulators (with reduced accuracy), or requires to produce a specific test chip with several thermal sensors. In this paper we propose a methodology and measurement setup that uses existing commercial processors to validate thermal models. We use infrared thermography and low-cost thermoelectric cooling, avoiding the issues of mineral oil setups used in previous works. We show how our approach was used to validate two thermal simulators.
  • Keywords
    infrared imaging; microprocessor chips; thermoelectric cooling; commercial processors; electronic devices; heat flux; infrared thermography; integrated circuits; low-cost thermoelectric cooling; low-cost validation setup; measurement setup; mineral oil; specific test chip; thermal modelling; thermal sensors; Cameras; Cooling; Heating; Integrated circuit modeling; Program processors; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    New Circuits and Systems Conference (NEWCAS), 2015 IEEE 13th International
  • Conference_Location
    Grenoble
  • Type

    conf

  • DOI
    10.1109/NEWCAS.2015.7182084
  • Filename
    7182084