DocumentCode
738529
Title
Avalanche Capability of Vertical GaN p-n Junctions on Bulk GaN Substrates
Author
Aktas, O. ; Kizilyalli, I.C.
Author_Institution
Avogy Inc., San Jose, CA, USA
Volume
36
Issue
9
fYear
2015
Firstpage
890
Lastpage
892
Abstract
Inductive avalanche test results presented in this letter demonstrate that GaN p-n diodes can sustain single-pulse and repetitive inductive avalanche currents. The 0.36-mm2 vertical GaN p-n diodes can sustain single-pulse avalanche currents as high as 10 A. The safe zone of the single-pulse avalanche current is limited by peak pulse power and energy deposited in the device. The temperature-dependent behavior of the breakdown voltage and the reverse-voltage at onset of avalanche has a positive temperature coefficient. Repetitive avalanche ruggedness testing was performed by applying 105 pulses at 5-kHz frequency with increasing repetitive stress current. Based on a population of 63 devices, the incremental failure rate under repetitive avalanche current increases with increasing avalanche current. The devices that survive the step stress test sustain no parametric drift under repetitive avalanche.
Keywords
III-V semiconductors; avalanche diodes; electric breakdown; gallium compounds; p-n junctions; wide band gap semiconductors; GaN; avalanche capability; breakdown voltage; bulk GaN substrates; frequency 5 kHz; inductive avalanche test; positive temperature coefficient; repetitive avalanche ruggedness testing; repetitive inductive avalanche currents; reverse-voltage; single-pulse avalanche currents; temperature-dependent behavior; vertical GaN p-n diodes; vertical GaN p-n junctions; Gallium nitride; Semiconductor diodes; Stress; Temperature dependence; Temperature measurement; Testing; Voltage measurement; Bulk GaN; PN diode; avalanche; avalanche ruggedness; vertical power semiconductors;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2015.2456914
Filename
7160669
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