• DocumentCode
    739441
  • Title

    Modular Multilevel Converter With Different Submodule Concepts—Part II: Experimental Validation and Comparison for HVDC Application

  • Author

    Solas, E. ; Abad, G. ; Barrena, J.A. ; Aurtenetxea, Sergio ; Carcar, Ainhoa ; Zajac, L.

  • Author_Institution
    Dept. of Electron. & Comput., Univ. of Mondragon, Mondragon, Spain
  • Volume
    60
  • Issue
    10
  • fYear
    2013
  • Firstpage
    4536
  • Lastpage
    4545
  • Abstract
    This paper is the continuation of part I in which a modulation strategy for the modular multilevel converter, which provides voltage balancing of the capacitors of different submodules comprising the converter, is presented. Here, the validation of the studied modulation strategy is carried out by means of successful experimental results in a downscaled real test bench. First, the converter submodules are 2L topologies, and then the connections are changed to configure 3L-FC submodules showing the effectiveness and implementability of the proposed modulation in different submodule concepts. Finally, a comparison based on thermal analysis and sizing of elements among 2L, 2L serializing several insulated gate bipolar transistors per valve, 3L-FC, and 3L-NPC submodule concepts is made.
  • Keywords
    HVDC power convertors; benchmark testing; insulated gate bipolar transistors; power capacitors; thermal analysis; 2L topology; 3L-FC submodule concept; 3L-NPC submodule concept; HVDC application; capacitor; downscaled real test bench; insulated gate bipolar transistor; modular multilevel converter; modulation strategy; thermal analysis; voltage balancing; Capacitors; Field programmable gate arrays; HVDC transmission; Insulated gate bipolar transistors; Modulation; Optical switches; Topology; Capacitor voltage balancing control; highvoltage direct current (HVDC); insulated gate bipolar transistors (IGBTs); modular multilevel converter (MMC); multilevel converter topologies; pulsewidth modulation; submodule concept;
  • fLanguage
    English
  • Journal_Title
    Industrial Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0046
  • Type

    jour

  • DOI
    10.1109/TIE.2012.2211431
  • Filename
    6257479