DocumentCode
740719
Title
The Conduction Characteristics of a 700 V Lateral Insulated-Gate Bipolar Transistor in a Junction Isolation Technology
Author
Ying-Chieh Tsai ; Jeng Gong ; Wing-Chor Chan ; Shyi-Yuan Wu ; Chenhsin Lien
Author_Institution
Dept. of Devices Dev. & Service, Macronix Int. Co., Ltd., Hsinchu, Taiwan
Volume
36
Issue
9
fYear
2015
Firstpage
929
Lastpage
931
Abstract
This letter presents the conduction characteristics of a 700 V n-type lateral insulated-gate bipolar transistor with quasi-vertical diffused metal-oxide-semiconductor (QVDMOS) field effect transistor fabricated with junction isolation technology. To improve the substrate leakage, a p-type buried layer (PBL) is inserted between the n-type drift region and the n-type buried layer. Measured results show that this structure successfully reduces the substrate current and ensures high breakdown voltage. Furthermore, due to the use of the QVDMOS cathode, an additional current path enables a reduction in the forward voltage drop. This letter shows that the PBL not only improves the dc properties of the device but also yields a shorter turn-OFF time.
Keywords
isolation technology; leakage currents; power MOSFET; semiconductor device breakdown; QVDMOSFET; high breakdown voltage; junction isolation technology; lateral insulated gate bipolar transistor; metal oxide semiconductor field effect transistor; quasivertical diffused MOSFET; substrate current reduction; substrate leakage; voltage 700 V; Anodes; Current measurement; Insulated gate bipolar transistors; Isolation technology; Junctions; Substrates; Voltage measurement; Lateral insulated-gate bipolar transistor (LIGBT); hole injection leakage; junction isolation technology;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2015.2453339
Filename
7217888
Link To Document