• DocumentCode
    740719
  • Title

    The Conduction Characteristics of a 700 V Lateral Insulated-Gate Bipolar Transistor in a Junction Isolation Technology

  • Author

    Ying-Chieh Tsai ; Jeng Gong ; Wing-Chor Chan ; Shyi-Yuan Wu ; Chenhsin Lien

  • Author_Institution
    Dept. of Devices Dev. & Service, Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • Volume
    36
  • Issue
    9
  • fYear
    2015
  • Firstpage
    929
  • Lastpage
    931
  • Abstract
    This letter presents the conduction characteristics of a 700 V n-type lateral insulated-gate bipolar transistor with quasi-vertical diffused metal-oxide-semiconductor (QVDMOS) field effect transistor fabricated with junction isolation technology. To improve the substrate leakage, a p-type buried layer (PBL) is inserted between the n-type drift region and the n-type buried layer. Measured results show that this structure successfully reduces the substrate current and ensures high breakdown voltage. Furthermore, due to the use of the QVDMOS cathode, an additional current path enables a reduction in the forward voltage drop. This letter shows that the PBL not only improves the dc properties of the device but also yields a shorter turn-OFF time.
  • Keywords
    isolation technology; leakage currents; power MOSFET; semiconductor device breakdown; QVDMOSFET; high breakdown voltage; junction isolation technology; lateral insulated gate bipolar transistor; metal oxide semiconductor field effect transistor; quasivertical diffused MOSFET; substrate current reduction; substrate leakage; voltage 700 V; Anodes; Current measurement; Insulated gate bipolar transistors; Isolation technology; Junctions; Substrates; Voltage measurement; Lateral insulated-gate bipolar transistor (LIGBT); hole injection leakage; junction isolation technology;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2015.2453339
  • Filename
    7217888