DocumentCode
74142
Title
DRAMA: An Architecture for Accelerated Processing Near Memory
Author
Farmahini-Farahani, Amin ; Jung Ho Ahn ; Morrow, Katherine ; Nam Sung Kim
Author_Institution
Electr. & Comput. Eng. Dept., Univ. of Wisconsin-Madison, Madison, WI, USA
Volume
14
Issue
1
fYear
2015
fDate
Jan.-June 1 2015
Firstpage
26
Lastpage
29
Abstract
Improving energy efficiency is crucial for both mobile and high-performance computing systems while a large fraction of total energy is consumed to transfer data between storage and processing units. Thus, reducing data transfers across the memory hierarchy of a processor (i.e., off-chip memory, on-chip caches, and register file) can greatly improve the energy efficiency. To this end, we propose an architecture, DRAMA, that 3D-stacks coarse-grain reconfigurable accelerators (CGRAs) atop off-chip DRAM devices. DRAMA does not require changes to the DRAM device architecture, apart from through-silicon vias (TSVs) that connect the DRAM device´s internal I/O bus to the CGRA layer. We demonstrate that DRAMA can reduce the energy consumption to transfer data across the memory hierarchy by 66-95 percent while achieving speedups of up to 18× over a commodity processor.
Keywords
DRAM chips; energy conservation; storage management; 3D-stacks coarse-grain reconfigurable accelerators; DRAM devices; DRAMA architecture; TSV; accelerated near memory processing; data transfers; dynamic random access memory; energy consumption reduction; energy efficiency; high-performance computing systems; memory hierarchy; mobile computing systems; processing units; storage units; through-silicon vias; total energy fraction; Acceleration; Arrays; Kernel; Memory management; Random access memory; Registers; Near memory processing, DRAM, 3D-stacking, energy-efficient computing, accelerator;
fLanguage
English
Journal_Title
Computer Architecture Letters
Publisher
ieee
ISSN
1556-6056
Type
jour
DOI
10.1109/LCA.2014.2333735
Filename
6846276
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