• DocumentCode
    74215
  • Title

    Self-Assembly Kinetics of Microscale Components: A Parametric Evaluation

  • Author

    Carballo, Jose M. ; Crane, Nathan B.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of South Florida, Tampa, FL, USA
  • Volume
    24
  • Issue
    4
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    839
  • Lastpage
    847
  • Abstract
    At the microscale, assembly by grasp and release is challenging. Self-assembly (SA) is an alternative component assembly method to significantly reduce assembly equipment costs. However, successful application of SA requires high assembly rates and high yield (few process errors). Prior modeling efforts describe SA process performance (yield and rate) for specific system configurations, but they do not use measurable process parameters and provide limited ability to predict the impact of process changes. In this paper, an experimental SA system was designed that controls process parameters independently while measuring SA outcomes. This system is used to evaluate a simple parameterization model for SA rate. The travel direction of the parts is varied to measure the path dependence of the assembly probability in the limit of low-impact velocity. Moreover, effects from changing part geometry are evaluated and accounted for in the model. Experimental results show a strong part-geometry dependence and minimal dependence on part arrival angle. This information is a key step toward a parametric kinetic model of capillary SA and complements previous SA process modeling efforts.
  • Keywords
    micromechanical devices; self-assembly; assembly equipment costs; assembly probability; component assembly method; microscale components; parametric evaluation; process changes; process errors; process parameters; self-assembly kinetics; Assembly; Bonding; Equations; Geometry; Kinetic theory; Liquids; Mathematical model; Electronics packaging; measurement; microassembly; modeling; performance evaluation; self-assembly; surface tension;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2014.2354137
  • Filename
    6901223