Title :
Hybrid On-Chip/In-Package Integrated Antennas for Millimeter-Wave Short-Range Communications
Author :
Luna, J.A.Z. ; Dussopt, Laurent ; Siligaris, Alexandre
Author_Institution :
CEA-LETI, Grenoble, France
Abstract :
A hybrid on-chip/in-package integrated antenna is designed and demonstrated for the first time in a QFN (quad flat no lead)-packaged 60-GHz ultra-wide-band (UWB) low-power transceiver. The on-chip radiating element is a folded dipole antenna realized on the transceiver high-resistivity silicon chip (CMOS-SOI technology). It is coupled electromagnetically to a patch antenna embedded under the package lid. The design was performed with a full 3D EM model of the packaged transceiver. The experimental radiation patterns and gain values are in agreement with the simulations, they show an antenna gain up to 4.6-8 dBi at 60 GHz and a 3-dB beamwidth 43° × 72°, suitable for short-range low-power Gbps communications.
Keywords :
CMOS integrated circuits; antenna radiation patterns; dipole antennas; hybrid integrated circuits; integrated circuit packaging; low-power electronics; microstrip antennas; millimetre wave antennas; millimetre wave integrated circuits; radio transceivers; silicon-on-insulator; CMOS-SOI technology; QFN; Si; folded dipole antenna; frequency 60 GHz; full 3D EM model; gain values; on-chip radiating element; package lid; patch antenna; quad flat no lead-packaged ultra-wide-band low-power transceiver; radiation patterns; short-range low-power Gbps communications; transceiver high-resistivity silicon chip; Antenna measurements; Antenna radiation patterns; Dipole antennas; Substrates; System-on-chip; Transceivers; 60 GHz; integrated antennas; millimeter-wave antennas; packaging; system-in-package; system-on-chip;
Journal_Title :
Antennas and Propagation, IEEE Transactions on
DOI :
10.1109/TAP.2013.2279832
