• DocumentCode
    745974
  • Title

    3-D finite element analysis and experimental investigation of electrodynamic repulsion force in molded case circuit breakers

  • Author

    Li, Xingwen ; Chen, Degui

  • Author_Institution
    Sch. of Electr. Eng., Xi´´an Jiaotong Univ., Xi´´an Shaanxi, China
  • Volume
    28
  • Issue
    4
  • fYear
    2005
  • Firstpage
    877
  • Lastpage
    883
  • Abstract
    To the optimization design of molded case circuit breakers (MCCBs), it is necessary and important to calculate the electro-dynamic repulsion force acting on the movable conductor. With three-dimensional (3-D) finite element nonlinear analysis, according to the equations among current-magnetic field-repulsion force and taking into account the ferromagnet, contact bridge model is introduced to simulate the current constriction between contacts, so Lorentz and Holm force acting on the movable conductor and contact, respectively, can be combined to calculate. Coupled with circuit equations, the opening time of movable contact also can be obtained using iteration with the restriction of contact force. Simulation and experiment for repulsion force and opening time of five different configuration models have been investigated. The results indicate that the proposed method is effective and capable of evaluating new design of contact systems in MCCBs.
  • Keywords
    circuit breakers; electrical contacts; electrodynamics; ferromagnetic materials; finite element analysis; 3D finite element analysis; 3D finite element nonlinear analysis; circuit equation; contact bridge model; contact force; current constriction; current-magnetic field-repulsion force; electrodynamic repulsion force; ferromagnet; molded case circuit breaker; movable conductor; optimization design; Analytical models; Bridge circuits; Circuit breakers; Circuit simulation; Conductors; Coupling circuits; Design optimization; Electrodynamics; Finite element methods; Nonlinear equations; Current constriction; finite element analysis; repulsion force;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2005.853175
  • Filename
    1546201