DocumentCode :
748368
Title :
SOI transistor measurement techniques using body contacted transistors
Author :
Worley, E.R. ; Williams, R.
Author_Institution :
Rockwell Int., Newport Beach, CA, USA
Volume :
36
Issue :
6
fYear :
1989
fDate :
12/1/1989 12:00:00 AM
Firstpage :
2192
Lastpage :
2198
Abstract :
Measurements of body-contacted SOI MOS transistors are used to isolate parameters of the back channel and island edge transistor. Properties of the edge and back channel transistor have been measured before and after X-ray irradiation using an ARACOR machine. The unique properties of the edge transistor are shown to be a result of edge geometry as confirmed by a two-dimensional transistor simulator. Two different edge FET characteristics were found; one is associated with the bottom corner and the other with the top corner. The bottom corner FET characteristic is dependent on positive charge trapping at the silicon-insulator interface. It has also been established that the V t shift with radiation of the top corner edge FET is comparable to the Vt shift of the top FET for the Rockwell SOS3H process
Keywords :
X-ray effects; insulated gate field effect transistors; radiation hardening (electronics); semiconductor device models; semiconductor technology; semiconductor-insulator boundaries; ARACOR machine; FET characteristics; MOSFET; Rockwell SOS3H process; SOI transistor measurement techniques; X-ray irradiation; back channel transistor; body contacted transistors; island edge transistor; positive charge trapping; threshold shift; Doping; Equations; Integrated circuit technology; Isolation technology; Least squares methods; Measurement techniques; Permittivity measurement; Semiconductor films; Silicon on insulator technology; Voltage;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.45424
Filename :
45424
Link To Document :
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