Influence of a metallic enclosure on the S-parameters of microstrip photonic bandgap structures

Author

Du, Zhengwei ; Gong, Ke ; Fu, Jeffrey S. ; Gao, Baoxin ; Feng, Zhenghe

Author_Institution

Dept. of Electron. Eng., Tsinghua Univ., Beijing, China

Volume

44

Issue

2

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

324

Lastpage

328

Abstract

Planar microstrip photonic bandgap (PBG) structures are periodic arrays of holes etched in the ground plane of a conventional microstrip line. Most of the published studies considered the PBG as an unshielded structure. However, to fabricate a circuit with a PBG structure, a metallic enclosure is often needed. Thus, the S-parameters of the PBG structure will be altered correspondingly. In this paper, the influence of the metallic enclosure on a shielded PBG structure as well as the finite ground plane on an unshielded PBG structure on the S-parameters are analyzed using the finite-difference time-domain (FDTD) method. Conditions for which the influence can be neglected are obtained. The results are useful for the applications of PBG structures

Keywords

S-parameters; earthing; electromagnetic shielding; finite difference time-domain analysis; microstrip lines; packaging; photonic band gap; FDTD method; S-parameters; electromagnetic crystals; finite ground plane; finite-difference time-domain method; ground plane; holes; metallic enclosure; microstrip line; microstrip photonic bandgap structures; periodic arrays; planar microstrip photonic bandgap structures; shielded PBG structure; unshielded PBG structure; unshielded structure; Circuits; Dielectrics; Etching; Finite difference methods; Frequency; Microstrip antenna arrays; Periodic structures; Photonic band gap; Scattering parameters; Time domain analysis;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/TEMC.2002.1003397

Filename

1003397