DocumentCode
750697
Title
Capacitance monitoring while flex testing
Author
Prymak, John D. ; Bergenthal, Jim
Author_Institution
Kemet Electron. Group, Greenville, SC, USA
Volume
18
Issue
1
fYear
1995
fDate
3/1/1995 12:00:00 AM
Firstpage
180
Lastpage
186
Abstract
As most other modes of failure for surface mount ceramic capacitors have been dramatically reduced over the years, cracking due to stresses from board bending have gained prominence. Cracking in ceramic capacitors can lead to instant failures or insidious, future field failures. The crack allows current leakage through the dielectric insulator with a voltage applied. This voltage can be much less than the rated voltage of the capacitor and still result in excessive leakage. Early attempts to identify susceptibility to this type of failure and the refinement of these techniques to establish a reliable and repeatable test with variables type of ratings is detailed within
Keywords
acoustic emission testing; bending; capacitance measurement; ceramic capacitors; circuit reliability; crack detection; electron device testing; failure analysis; monitoring; printed circuit testing; surface mount technology; board bending; capacitance monitoring; cracking; current leakage; failure; flex testing; stresses; surface mount ceramic capacitors; Assembly; Capacitance; Capacitors; Ceramics; Condition monitoring; Dielectrics; Stress; Surface cracks; Testing; Voltage;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
Publisher
ieee
ISSN
1070-9886
Type
jour
DOI
10.1109/95.370753
Filename
370753
Link To Document