• DocumentCode
    750697
  • Title

    Capacitance monitoring while flex testing

  • Author

    Prymak, John D. ; Bergenthal, Jim

  • Author_Institution
    Kemet Electron. Group, Greenville, SC, USA
  • Volume
    18
  • Issue
    1
  • fYear
    1995
  • fDate
    3/1/1995 12:00:00 AM
  • Firstpage
    180
  • Lastpage
    186
  • Abstract
    As most other modes of failure for surface mount ceramic capacitors have been dramatically reduced over the years, cracking due to stresses from board bending have gained prominence. Cracking in ceramic capacitors can lead to instant failures or insidious, future field failures. The crack allows current leakage through the dielectric insulator with a voltage applied. This voltage can be much less than the rated voltage of the capacitor and still result in excessive leakage. Early attempts to identify susceptibility to this type of failure and the refinement of these techniques to establish a reliable and repeatable test with variables type of ratings is detailed within
  • Keywords
    acoustic emission testing; bending; capacitance measurement; ceramic capacitors; circuit reliability; crack detection; electron device testing; failure analysis; monitoring; printed circuit testing; surface mount technology; board bending; capacitance monitoring; cracking; current leakage; failure; flex testing; stresses; surface mount ceramic capacitors; Assembly; Capacitance; Capacitors; Ceramics; Condition monitoring; Dielectrics; Stress; Surface cracks; Testing; Voltage;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.370753
  • Filename
    370753