DocumentCode
75220
Title
Transfer Function Method for Predicting the Emissions in a CISPR-25 Test-Setup
Author
Radchenko, Andriy ; Khilkevich, Victor V. ; Bondarenko, Natalia ; Pommerenke, David ; Gonser, Markus ; Hansen, Jonas ; Keller, Chris
Author_Institution
Missouri Univ. of Sci. & Technol., Rolla, MO, USA
Volume
56
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
894
Lastpage
902
Abstract
The CISPR-25 standard is used in the automotive industry to characterize the electromagnetic radiation of electronic components. The setup is comprised of an electronic device, a cable harness, a metallic table, and an antenna. Dimensions stretch from a couple of meters for the setup to fractions of a millimeter for printed circuit board features. Numerical prediction of radiated emissions (RE) is of great usefulness for prediction of potential electromagnetic compatibility nonconformities in the early design process, but extremely difficult to be done for this setup as a whole. In this paper, we demonstrate how RE can efficiently be computed based on a setup as commonly used to model conducted emissions only, i.e., electric control unit and harness on infinite-ground plane. Applying Huygens principle and using it to generate a fixed transfer function between a particularly chosen Huygens surface and the antenna, we arrive at a novel computing scheme for RE. The scheme is applied for the antenna model and antenna factor-based calculations and demonstrates agreement with measurements within 5 dB range.
Keywords
antennas; automobile industry; electromagnetic waves; emission; printed circuits; transfer functions; CISPR-25 test setup; Huygens principle; RE; antenna; automotive industry; cable harness; dimensions stretch; electric control unit; electromagnetic compatibility; electromagnetic radiation; electronic components; electronic device; emission prediction; fixed transfer function; infinite ground plane; metallic table; numerical prediction; printed circuit board features; radiated emissions; transfer function method; Antenna measurements; Computational modeling; Ports (Computers); Power cables; Receiving antennas; Wires; Electromagnetic compatibility (EMC); electromagnetic coupling; electromagnetic emission; numerical analysis;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2013.2297303
Filename
6722882
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