Title :
Efficient asynchronous bundled-data pipelines for DCT matrix-vector multiplication
Author :
Tugsinavisut, Sunan ; Hong, Youpyo ; Kim, Daewook ; Kim, Kyeounsoo ; Beerel, Peter A.
Author_Institution :
Electr. Eng. Dept., Univ. of Southern California, Los Angeles, CA, USA
fDate :
4/1/2005 12:00:00 AM
Abstract :
This paper demonstrates the design of efficient asynchronous bundled-data pipelines for the matrix-vector multiplication core of discrete cosine transforms (DCTs). The architecture is optimized for both zero and small-valued data, typical in DCT applications, yielding both high average performance and low average power. The proposed bundled-data pipelines include novel data-dependent delay lines with integrated control circuitry to efficiently implement speculative completion sensing. The control circuits are based on a novel control-circuit template that simplifies the design of such nonlinear pipelines. Extensive post-layout back-end timing analysis was performed to gain confidence in the timing margins as well as to quantify performance and energy. Comparison with a synchronous counterpart suggests that our best asynchronous design yields 30% higher average throughput with negligible energy overhead.
Keywords :
VLSI; asynchronous circuits; delay lines; discrete cosine transforms; logic design; matrix multiplication; asynchronous bundled-data pipelines; asynchronous design; asynchronous pipelines; control-circuit template; data-dependent delay lines; discrete cosine transforms; energy overhead; four-phase full buffer; integrated control circuitry; matrix-vector multiplication; nonlinear pipelines; speculative completion sensing; timing analysis; Centralized control; Data compression; Delay lines; Discrete cosine transforms; Integrated circuit yield; Performance analysis; Pipelines; Protocols; Timing; Transform coding; Asynchronous pipelines; bundled-data pipelines; control circuit templates; discrete cosine transforms; matrix–vector multiplication; precharged full buffer; true four-phase full buffer;
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
DOI :
10.1109/TVLSI.2004.842908