Title :
SEU characterization of a hardened CMOS 64K and 256K SRAM
Author :
Sexton, F.W. ; Fu, J.S. ; Kohler, R.A. ; Koga, R.
Author_Institution :
Sandia Nat. Lab., Albuquerque, NM, USA
fDate :
12/1/1989 12:00:00 AM
Abstract :
The first single-event-upset (SEU) tests of the AT&T 64K and 256K SRAMs (static random-access memories) have been performed. Feedback resistor values for these parts ranged from 200 kΩ to 1 MΩ. All were fabricated using the 1-μm, 2-level-poly, 2-level-metal process. Ions used for the tests were Ar, Cu, Kr, and Xe, providing a range of effective LET (linear energy transfer) values from 20 to 129 MeV-cm2/mg. With the 64K SRAM operating at 4.5 V and 90°C, an upset threshold LET of 30 MeV-cm2/mg and saturation cross section of 1.5×10-2 cm2 were measured with a nominal room-temperature feedback resistance of 450 kΩ. In Adam´s 10% worst-case environment using the Petersen approximation (see E.L. Petersen et al., ibid., vol.NS-30, p.4533-9, Dec. 1983) this implies an error rate of 1.3×10-7 errors per bit-day. With a nominal 650-kΩ feedback resistance, a 256K SRAM had a calculated error rate of about 3×10-8 errors power bit-day at 4.5 V and 90°C. These data agree well with earlier data for a 1 kb test chip. The minimal feedback resistance required to prevent upset versus LET is calculated, using an activation energy of 0.10 eV to estimate the decrease in feedback resistor value as a function of temperature
Keywords :
CMOS integrated circuits; integrated circuit testing; integrated memory circuits; ion beam effects; radiation hardening (electronics); random-access storage; 1 micron; 2-level-metal process; 200 to 1000 kohm; 256 kbit; 256K SRAM; 4.5 V; 64 kbit; 64K SRAM; 90 C; AT&T; Ar ions; Cu ions; Kr ions; SEU characterization; Xe ions; error rate; feedback resistance; hardened CMOS SRAMs; linear energy transfer; range of effective LET; saturation cross section; static random-access memories; upset threshold LET; Argon; Electrical resistance measurement; Energy exchange; Error analysis; Feedback; Performance evaluation; Random access memory; Resistors; Temperature; Testing;
Journal_Title :
Nuclear Science, IEEE Transactions on