DocumentCode :
753870
Title :
Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress Data
Author :
Xie, Jingsong ; He, Jing-Jing ; Zhang, Yuan ; Freda, Michael
Author_Institution :
Failure Anal. & Phys. Res. Lab. (FAPRL), Beijing Univ. of Aeronaut. & Astronaut. (BUAA), Beijing
Volume :
31
Issue :
3
fYear :
2008
Firstpage :
634
Lastpage :
641
Abstract :
Accelerated thermal stress tests nowadays have widely been used in qualification and reliability assessment of printed wiring boards (PWBs). Predicting the field life of plated through holes (PTHs) from test data has been a primary goal of this type of testing. Understanding the PTH cycles to failure (CTF) versus temperature relationship and having a good estimate of acceleration factor (AF) not only expedites the data processing process but also helps in optimizing test conditions and minimizing the number of tests, and hence, reducing the test cost. In this paper, three different PTH CTF-temperature models, including an inverse power law (IPL) model, an IPC model, and an enhanced PTH fatigue-life prediction model, are discussed and evaluated in their effectiveness of determining acceleration factors for the purpose of PTH field life prediction under different test conditions. In addition, using the third model, AF influencing factors, including PTH geometric dimensions, PWB glass transition temperatures (Tg), and the temperature dependency of PWB material properties, are also discussed to provide information for accelerated test design in PWB qualification and reliability assessment.
Keywords :
printed circuits; thermal stresses; PTH CTF-temperature models; PTH cycles to failure; PTH fatigue-life prediction model; PWB glass transition temperatures; accelerated thermal stress tests; acceleration factor; field life; inverse power law; plated through holes; printed wiring boards; reliability assessment; thermal stress data; Field life; plated through holes; printed wiring board; reliability assessment;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2008.922011
Filename :
4544570
Link To Document :
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