• DocumentCode
    755086
  • Title

    Artificial neural network model-based run-to-run process controller

  • Author

    Wang, Xing A. ; Mahajan, R.L.

  • Author_Institution
    Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
  • Volume
    19
  • Issue
    1
  • fYear
    1996
  • fDate
    1/1/1996 12:00:00 AM
  • Firstpage
    19
  • Lastpage
    26
  • Abstract
    In this paper, we present an artificial neural network (ANN) model-based controller for a batch semiconductor manufacturing process. The proposed controller is an integration of ANN, statistical process control (SPC), and automatic process control (APC) techniques. An ANN model trained with design of experiments (DOE) data is used to map the input-output relation of the process. The controller model is then extracted from the ANN process model by Taylor expansion and inversion. For application to a noisy process, the exponential weighted moving average (EWMA) technique is first used to filter out the output noise and detect the process shift/drift. Based on feedback, the controller tunes the settings to compensate for the process shift/drift. Experimental data on a laboratory chemical vapor deposition (CVD) reactor is used to demonstrate the effectiveness of the proposed run-to-run controller. A comparison shows that the proposed controller performs better than other similar controllers. Finally, a total cost criterion is proposed to provide optimum parameters for a run-to-run controller
  • Keywords
    batch processing (industrial); chemical vapour deposition; design of experiments; neurocontrollers; process control; semiconductor device manufacture; statistical process control; Taylor expansion; artificial neural network model; automatic process control; batch semiconductor manufacturing; chemical vapor deposition; design of experiments; exponential weighted moving average; feedback; noise filtering; process shift/drift; run-to-run process controller; statistical process control; Artificial neural networks; Automatic control; Data mining; Filters; Laboratories; Manufacturing processes; Process control; Semiconductor device noise; Taylor series; US Department of Energy;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1083-4400
  • Type

    jour

  • DOI
    10.1109/3476.484201
  • Filename
    484201