S-parameters characterization of through, blind, and buried via holes

A method for de-embedding the scattering parameters matrix for single-end or differential through, buried, and blind via holes in multilayer printed circuit boards for high-speed digital applications is presented. The proposed technique starts from a measurement or simulation of the structure containing the discontinuity and, after the structure´s partitioning, extracts the scattering parameters of the required discontinuity. The procedure is applied to different kinds of single-ended and differential via holes and is validated by measurements. The finite integration technique is used to perform the needed three-dimensional electromagnetic simulations. Due to its reduced CPU time, the proposed methodology is suitable for a parametric analysis on the electrical performance of the via hole discontinuities and it gives useful results for the extraction of accurate computer-aided design models.