Title :
High-Performance Vertical Gate-All-Around Silicon Nanowire FET With High-
/Metal Gate
Author :
Yujia Zhai ; Mathew, Lini ; Rao, Ramesh ; Palard, Marylene ; Chopra, Sonik ; Ekerdt, John G. ; Register, Leonard F. ; Banerjee, Sanjay K.
Author_Institution :
Microelectron. Res. Center, Univ. of Texas at Austin, Austin, TX, USA
Abstract :
We present a vertical gate-all-around Si nanowire (SiNW) metal-oxide-semiconductor field-effect transistor with high-κ dielectric and TiN metal gate. The process flow is fully compatible with CMOS technologies. SiNWs are fabricated by deep Si reactive ion etching, gate-stack is formed by atomic layer deposition, and metal salicide is utilized as drain contact. The fabricated p-type gate-all-around SiNW metal-oxide-semiconductor field-effect transistors that have a gate length of 320 nm exhibit excellent characteristics with ION/IOFF > 104, subthreshold slope of 87 mV/decade, and 25 mV/V of drain-induced barrier lowering. Low-temperature characteristics are also presented. The demonstrated devices have potential applications in novel low-power logic circuits and as selection transistors for 4F2 cross-point memory cells.
Keywords :
CMOS integrated circuits; MOSFET; atomic layer deposition; elemental semiconductors; field effect transistors; high-k dielectric thin films; logic circuits; low-power electronics; nanowires; silicon; sputter etching; titanium compounds; 4F2 cross-point memory cells; CMOS technologies; FET; Si; SiNW; TiN; atomic layer deposition; drain-induced barrier; high-κ dielectric; low-power logic circuits; metal gate; metal salicide; metal-oxide semiconductor field effect transistor; reactive ion etching; size 320 nm; vertical gate-all-around silicon nanowire; Dielectrics; Logic gates; MOSFET; Silicon; Tin; CMOS technology; deep Si etching; gate-all-around; high- (kappa ) /metal gate; high-k/metal gate; nanowire; salicide;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2014.2353658