• DocumentCode
    758146
  • Title

    Foreword - Special issue on emerging technologies

  • Author

    Amon, C.H. ; Goodson, Kenneth ; Luo, Gang

  • Author_Institution
    Carnegie Mellon University
  • Volume
    26
  • Issue
    2
  • fYear
    2003
  • fDate
    6/1/2003 12:00:00 AM
  • Firstpage
    307
  • Lastpage
    308
  • Keywords
    Computational fluid dynamics; Conference management; Electronic packaging thermal management; Heat sinks; Mechanical engineering; Paper technology; Thermal conductivity; Thermal management; Thermomechanical processes; USA Councils;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2003.816231
  • Filename
    1218225
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=758146