Title :
Foreword - Special issue on emerging technologies
Author :
Amon, C.H. ; Goodson, Kenneth ; Luo, Gang
Author_Institution :
Carnegie Mellon University
fDate :
6/1/2003 12:00:00 AM
Keywords :
Computational fluid dynamics; Conference management; Electronic packaging thermal management; Heat sinks; Mechanical engineering; Paper technology; Thermal conductivity; Thermal management; Thermomechanical processes; USA Councils;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2003.816231
