• DocumentCode
    758153
  • Title

    Electrothermally activated paraffin microactuators

  • Author

    Carlen, Edwin T. ; Mastrangelo, Carlos H.

  • Author_Institution
    Intellisense Corp., Wilmington, MA, USA
  • Volume
    11
  • Issue
    3
  • fYear
    2002
  • fDate
    6/1/2002 12:00:00 AM
  • Firstpage
    165
  • Lastpage
    174
  • Abstract
    A new family of electrothermally activated microactuators that can provide both large displacements and forces, are simple to fabricate, and are easily integrated with a large variety of microelectronic and microfluidic components are presented. The actuators use the high volumetric expansion of a sealed, surface micromachined patch of paraffin heated near its melting point to deform a sealing diaphragm. Two types of actuators have been fabricated using a simple three mask fabrication process. The first device structure consists of a 9 μm thick circularly patterned paraffin layer ranging in diameter from 400 to 800 μm all covered with a 4-μm-thick metallized p-xylylene sealing diaphragm. All fabricated devices produced a 2.7-μm-peak center deflection, consistent with a simple first order theory. The second actuator structure uses a constrained volume reservoir that magnifies the diaphragm deflection producing consistently 3.2 μm center diaphragm deflection with a 3-μm-thick paraffin actuation layer. Microactuators were constructed on both glass and silicon substrates. The actuators fabricated on glass substrates used between 50-200 mW of electrical power with response times ranging between 30-50 ms. The response time for silicon devices was much faster (3-5 ms) at the expense of a larger electrical power (500-2000 mW)
  • Keywords
    diaphragms; etching; microactuators; microfluidics; micromachining; organic compounds; solid-liquid transformations; thermal expansion; 3 to 5 ms; 30 to 50 ms; 400 to 800 micron; 50 to 200 mW; 500 to 2000 mW; 9 micron; circularly patterned paraffin layer; constrained volume reservoir; electrothermally activated microactuators; etch mask layers; glass substrates; heating elements; high volumetric expansion; hydraulic advantage structure; large displacements; large forces; metallized p-xylylene diaphragm; microfluidic components; paraffin microactuators; parylene diaphragm; piston-type microactuator; sealed surface micromachined patch; sealing diaphragm; silicon substrates; solid-liquid phase-change microactuator; specific volume; thermal conductivity; thermal expansion; three dimensional electrothermal model; three mask fabrication process; Actuators; Delay; Electrothermal effects; Fabrication; Glass; Metallization; Microactuators; Microelectronics; Microfluidics; Reservoirs;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.1007394
  • Filename
    1007394