• DocumentCode
    758264
  • Title

    A Lagrangian approach for electrostatic analysis of deformable conductors

  • Author

    Li, Gang ; Aluru, N.R.

  • Author_Institution
    Dept. of Mech. & Ind. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    11
  • Issue
    3
  • fYear
    2002
  • fDate
    6/1/2002 12:00:00 AM
  • Firstpage
    245
  • Lastpage
    254
  • Abstract
    Deformable conductors are frequently encountered in microelectromechanical systems (MEMS). For example, in electrostatic MEMS, microstructures undergo deformations because of electrostatic forces caused by applied potentials. Computational analysis of electrostatic MEMS requires an electrostatic analysis to compute the electrostatic forces acting on micromechanical structures and a mechanical analysis to compute the deformation of micromechanical structures. Typically, the mechanical analysis is performed by a Lagrangian approach using the undeformed position of the structures. However, the electrostatic analysis is performed by using the deformed position of the conductors. In this paper, we introduce a Lagrangian approach for electrostatic analysis. In this approach, when the conductors undergo deformation or shape changes, the surface charge densities on the deformed conductors can be computed without updating the geometry of the conductors. The Lagrangian approach is a simple, but critical, idea that radically simplifies the analysis of electrostatic MEMS
  • Keywords
    conductors (electric); electrostatic devices; micromechanical devices; surface charging; Lagrangian approach; deformable conductors; deformed position; electrostatic MEMS; electrostatic analysis; mechanical analysis; shape changes; surface charge densities; Algorithm design and analysis; Computational geometry; Conductors; Electrostatic analysis; Lagrangian functions; Microelectromechanical systems; Micromechanical devices; Performance analysis; Structural beams; Voltage;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2002.1007403
  • Filename
    1007403