Title :
Dual-Stacked Current Recycling Linear Regulators With 48% Power Saving for Biomedical Implants
Author :
Yuanyuan Yang ; Hosung Chun ; Lehmann, T.
Author_Institution :
Sch. of Electr. Eng. & Telecommun., Univ. of New South Wales, Sydney, NSW, Australia
Abstract :
This paper demonstrates a dual-stacked current recycling linear power supply circuit for biomedical implants. Implantable neuro-stimulators often require high-voltage power supplies for electrode actuation purposes while most of the electronic implant sub-systems require low-voltage supplies which are often generated by linear regulators with poor power efficiency. The proposed current recycling technique and circuit allow linear regulators to be stacked, dividing the high-voltage power supply into two low-voltage supply domains; current can be recycled between these two power supplies and power efficiency in the low-voltage powered circuits can be close to doubled. The power supply circuit is implemented in 0.35 μm high-voltage CMOS process and occupies an active silicon area of 0.45 mm2 , achieving maximum power saving factor and current efficiency of 48.6% and 97.2%, respectively, with quiescent current of only 45 μA.
Keywords :
CMOS integrated circuits; low-power electronics; power supply circuits; prosthetic power supplies; biomedical implant; current 45 muA; current efficiency; dual-stacked current recycling linear power supply circuit; dual-stacked current recycling linear regulator; electrode actuation; electronic implant subsystem; high-voltage CMOS process; high-voltage power supply; implantable neuro-stimulator; low-voltage powered circuit; low-voltage supply domain; power efficiency; power saving factor; recycling technique; size 0.35 mum; Implants; Logic gates; Power supplies; Rails; Recycling; Regulators; Voltage control; Biomedical implants; CMOS; DMOS; current efficiency; current recycling; current saving; high-voltage; linear power supply; linear regulator; neuro-stimulator; process variations and mismatch;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2012.2226489