DocumentCode
759837
Title
Simulation analysis of the connecting transport AMHS in a wafer fab
Author
Lin, James T. ; Wang, Fu-Kwun ; Wu, Chun-Kuan
Author_Institution
Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
16
Issue
3
fYear
2003
Firstpage
555
Lastpage
564
Abstract
This paper analyzes the performance of the connecting transport automated material handling system (AMHS) in a wafer fab. Discrete-event simulation models are developed in e-M Plant to study connecting transport in a simplified 300 mm wafer fab. A two-phase experimental approach evaluates the connecting transport. In phase I, the simulation results show that the connecting transport method has a significant effect on average travel time, throughput, and vehicle utilization. The relationship between vehicle quantity and the material flow rate is investigated in a simulation model for three connecting transport methods. The performance measures of these two factors can be predicted with a response surface method. However, none of the connecting transport methods outperforms the others in the different operating scenarios. In phase II, the connecting transport method is a mixture of the three existing methods. Thus, the optimum combination of these methods can be obtained with a mixture of experiment.
Keywords
discrete event simulation; materials handling; response surface methodology; semiconductor device manufacture; transportation; 300 mm; automated material handling system; connecting transport method; discrete-event simulation model; e-M Plant; response surface method; semiconductor manufacturing; wafer fab; Analytical models; Industrial engineering; Joining processes; Manufacturing automation; Materials handling; Performance analysis; Production facilities; Semiconductor device manufacture; Semiconductor device modeling; Vehicles;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2003.815211
Filename
1219504
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