• DocumentCode
    759837
  • Title

    Simulation analysis of the connecting transport AMHS in a wafer fab

  • Author

    Lin, James T. ; Wang, Fu-Kwun ; Wu, Chun-Kuan

  • Author_Institution
    Dept. of Ind. Eng. & Eng. Manage., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    16
  • Issue
    3
  • fYear
    2003
  • Firstpage
    555
  • Lastpage
    564
  • Abstract
    This paper analyzes the performance of the connecting transport automated material handling system (AMHS) in a wafer fab. Discrete-event simulation models are developed in e-M Plant to study connecting transport in a simplified 300 mm wafer fab. A two-phase experimental approach evaluates the connecting transport. In phase I, the simulation results show that the connecting transport method has a significant effect on average travel time, throughput, and vehicle utilization. The relationship between vehicle quantity and the material flow rate is investigated in a simulation model for three connecting transport methods. The performance measures of these two factors can be predicted with a response surface method. However, none of the connecting transport methods outperforms the others in the different operating scenarios. In phase II, the connecting transport method is a mixture of the three existing methods. Thus, the optimum combination of these methods can be obtained with a mixture of experiment.
  • Keywords
    discrete event simulation; materials handling; response surface methodology; semiconductor device manufacture; transportation; 300 mm; automated material handling system; connecting transport method; discrete-event simulation model; e-M Plant; response surface method; semiconductor manufacturing; wafer fab; Analytical models; Industrial engineering; Joining processes; Manufacturing automation; Materials handling; Performance analysis; Production facilities; Semiconductor device manufacture; Semiconductor device modeling; Vehicles;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2003.815211
  • Filename
    1219504