Lumped Parameter Modeling for Thermal Characterization of High-Power Modules

Author

Iachello, Marco ; De Luca, Viviana ; Petrone, Giovanni ; Testa, Natale ; Fortuna, Luigi ; Cammarata, Giuliano ; Graziani, Salvatore ; Frasca, Mattia

Author_Institution

Dipt. di Ing. Elettr. Elettron. e Inf., Univ. di Catania, Catania, Italy

Volume

4

Issue

10

fYear

2014

fDate

Oct. 2014

Firstpage

1613

Lastpage

1623

Abstract

Power electronic modules are realized by integrating several semiconductor chips inside one package. In this paper, a new thermal modeling procedure and its application to a power electronic module are presented. The adopted modeling strategy consists of the derivation of numerical thermal impedances by 3-D finite element models, validated by comparison with available experimental data, and of the coefficients identification of the RC passive network, through a specific topology, here introduced, to obtain a lumped parameter model of the thermal behavior of the module.

Keywords

RC circuits; finite element analysis; lumped parameter networks; multichip modules; passive networks; power semiconductor devices; thermal analysis; 3D finite element models; RC passive network; coefficients identification; electronic multichip devices; high-power modules; lumped parameter modeling; numerical thermal impedances; power electronic modules; semiconductor chips; thermal behavior; thermal characterization; thermal modeling procedure; Data models; Impedance; Integrated circuit modeling; Iron; Network topology; Numerical models; Solid modeling; (RC) passive network; Finite element (FE) thermal model; RC passive network; power module; thermal impedances;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2353695

Filename

6902791