• DocumentCode
    763946
  • Title

    Demonstrated reliability of plastic-encapsulated microcircuits for missile applications

  • Author

    Tam, Sun Man

  • Author_Institution
    Texas Instrum. Inc., USA
  • Volume
    44
  • Issue
    1
  • fYear
    1995
  • fDate
    3/1/1995 12:00:00 AM
  • Firstpage
    8
  • Lastpage
    13
  • Abstract
    For the past decade, overall reliability improvement and product availability have enabled plastic encapsulated microcircuits (PEM) to move from consumer electronics beyond the relatively large and reliability-conscious automotive market, into the military market. Based on the analysis of the worst-case PEM scenario for military applications, demonstrating the moisture reliability under long-term (20 years) dormant storage environments has become the last hurdle for PEM. Studies have demonstrated that PEM can meet the typical missile environments in long-term storage. To further validate PEM reliability in missile applications, Texas Instruments (TI) conducted three separate studies involving 6 years of PEM moisture-life monitoring and assessment, testing of the standard PEM electrical characteristics under the military temperature ranges (-55°C to +125°C), and assessing their robustness in moisture environments after the assembly processes. These TI studies support the use of PEM in missile (or similar) applications. Effective focus on part and supplier selection, supplier teaming, and process monitoring is necessary to maintain the PEM reliability over the required environments at the lowest cost. This paper assesses PEM reliability for a selected missile storage environment using the industry-standard moisture testing, such as biased HAST or 85°C/85%RH (relative humidity), for demonstrating the PEM moisture survivability. The moisture reliability (MTTF) or average moisture lifetime of PEM is assessed to correlate PEM capability to anticipated field-performance environments
  • Keywords
    circuit reliability; encapsulation; humidity; integrated circuit packaging; integrated circuits; life testing; military equipment; missiles; moisture measurement; monitoring; plastic packaging; 20 y; 6 y; MTTF; Texas Instruments; average moisture lifetime; dormant storage environments; electrical characteristics testing; missile applications; moisture reliability; moisture-life monitoring; plastic-encapsulated microcircuits; relative humidity; robustness assessment; Automotive engineering; Availability; Consumer electronics; Instruments; Military standards; Missiles; Moisture; Monitoring; Plastics; Testing;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.376512
  • Filename
    376512