DocumentCode :
765606
Title :
Influence of uniaxial tensile strain on the performance of partially depleted SOI CMOS ring oscillators
Author :
Zhao, Wei ; Seabaugh, Alan ; Winstead, Brian ; Jovanovic, Dejan ; Adams, Vance
Author_Institution :
Dept. of Electr. Eng., Univ. of Notre Dame, IN, USA
Volume :
27
Issue :
1
fYear :
2006
Firstpage :
52
Lastpage :
54
Abstract :
The influence of uniaxial tensile strain on the performance of advanced partially depleted silicon-on-insulator CMOS ring oscillators is reported. Strain is applied either perpendicular or parallel to the direction of current flow by bending of thinned, fully processed wafers with a gate oxide thickness of less than 1.5 nm. Interestingly, the standby power dissipation of the ring oscillators increases for both parallel and perpendicular strains due to changes in the gate tunneling currents with strain. The on-state power dissipation decreases with parallel strain and increases with perpendicular strain consistent with the expected changes in the inversion layer piezoresistance. The speed of the ring oscillators improves with perpendicular strain and degrades with parallel strain, which can also be understood in terms of the piezoresistance changes.
Keywords :
CMOS analogue integrated circuits; oscillators; piezoresistance; silicon-on-insulator; tunnelling; MOSFET device; SOI CMOS ring oscillators; gate tunneling current; inversion layer piezoresistance; parallel strains; perpendicular strains; silicon-on-insulator CMOS ring oscillators; standby power dissipation; uniaxial tensile strain effects; CMOS process; Capacitive sensors; MOSFET circuits; Piezoresistance; Power dissipation; Ring oscillators; Silicon on insulator technology; Stress; Tensile strain; Tunneling; MOSFET; silicon-on-insulator (SOI); stress effects; tunneling; uniaxial strain;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2005.861022
Filename :
1561453
Link To Document :
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