• DocumentCode
    766979
  • Title

    Materials Selection and Design of Microelectrothermal Bimaterial Actuators

  • Author

    Prasanna, Srinivasan ; Spearing, S. Mark

  • Author_Institution
    Southampton Univ.
  • Volume
    16
  • Issue
    2
  • fYear
    2007
  • fDate
    4/1/2007 12:00:00 AM
  • Firstpage
    248
  • Lastpage
    259
  • Abstract
    A common form of MEMS actuator is a thermally actuated bimaterial, which is easy to fabricate by surface micromachining and permits out of plane actuation, which is otherwise difficult to achieve. This paper presents an analytical framework for the design of such microelectrothermal bimaterial actuators. Mechanics relationships for a cantilever bimaterial strip subjected to a uniform temperature were applied to obtain expressions for performance metrics for the actuator, i.e., maximum work/volume, blocked (force) moment, and free-end (displacement) slope. Results from finite-element analysis and closed form relations agree well to within 1%. The optimal performance for a given pair of materials and the corresponding thickness ratio were determined. Contours of equal performance corresponding to commonly used substrates (e.g., Si, SiO2) were plotted in the domain of governing material properties (thermal expansion coefficient and Young\´s modulus) to identify candidate materials for further development. These results and the accompanying methodology provide a rational basis for comparing the suitability of "standard" materials for microelectrothermal actuators, as well as identifying materials that might be suitable for further research
  • Keywords
    Young´s modulus; finite element analysis; microactuators; micromachining; thermal expansion; MEMS actuator; Young modulus; cantilever bimaterial strip; finite-element analysis; materials selection; mechanics relationships; microactuators; microelectrothermal bimaterial actuators; surface micromachining; thermal expansion coefficient; thermally actuated biomaterial; thermoelasticity; Actuators; CMOS technology; Electrothermal effects; Fabrication; Micromechanical devices; Semiconductor films; Semiconductor materials; Silicon; Thermal expansion; Thermal resistance; Microactuators; optimization; performance and thermoelasticity;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2006.889528
  • Filename
    4147600