DocumentCode :
766998
Title :
Thermoplastic Forming of Bulk Metallic Glass— A Technology for MEMS and Microstructure Fabrication
Author :
Schroers, Jan ; Pham, Quoc ; Desai, Amish
Author_Institution :
Liquidmetal Technol., Lake Forest, CA
Volume :
16
Issue :
2
fYear :
2007
fDate :
4/1/2007 12:00:00 AM
Firstpage :
240
Lastpage :
247
Abstract :
A technology for microelectromechanical systems (MEMS) and microstructure fabrication is introduced where the bulk metallic glass (BMG) is formed at a temperature where the BMG exist as a viscous liquid under an applied pressure into a mold. This thermoplastic forming is carried out under comparable forming pressure and temperatures that are used for plastics. The range of possible sizes in all three dimensions of this technology allows the replication of high strength features ranging from about 30 nm to centimeters with aspect ratios of 20 to 1, which are homogeneous and isotropic and free of stresses and porosity. Our processing method includes a hot-cutting technique that enables a clean planar separation of the parts from the BMG reservoir. It also allows to net-shape three-dimensional parts on the micron scale. The technology can be implemented into conventional MEMS fabrication processes. The properties of BMG as well as the thermoplastic formability enable new applications and performance improvements of existing MEMS devices and nanostructures
Keywords :
cutting; metallic glasses; micromachining; micromechanical devices; porosity; thermoforming; MEMS; bulk metallic glass; hot cutting; materials processing; microelectromechanical devices; microstructure fabrication; planar separation; thermoplastic forming; Fabrication; Glass; Microelectromechanical devices; Microelectromechanical systems; Micromechanical devices; Microstructure; Plastics; Reservoirs; Stress; Temperature; Amorphous materials; bulk metallic glass; materials processing; microelectromechanical devices; nanotechnology; thermoplastic processing;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.0007.892889
Filename :
4147602
Link To Document :
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