Characterization of micromachined transitions for high-speed integrated packages

Author

Drayton, Rhonda Franklin ; Banerjee, S. Riki ; Haley, Jeremy L.

Author_Institution

Dept. of Electr. & Comput. Eng., Minnesota Univ., Minneapolis, MN, USA

Volume

50

Issue

5

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

693

Lastpage

697

Abstract

Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition

Keywords

integrated circuit packaging; micromachining; microstrip discontinuities; microstrip transitions; substrates; conductor discontinuities; constant impedance designs; dielectric discontinuities; high-speed integrated packages; integrated circuit packaging; low dispersion design; micromachined transitions; microstrip transitions; printed interconnects; substrate; Circuit synthesis; Circuit testing; Conductors; Dielectric constant; Dielectric substrates; High speed integrated circuits; Integrated circuit interconnections; Micromachining; Microstrip; Packaging;

fLanguage

English

Journal_Title

Antennas and Propagation, IEEE Transactions on

Publisher

ieee

ISSN

0018-926X

Type

jour

DOI

10.1109/TAP.2002.1011236

Filename

1011236