SPICE-models for high-pincount board connectors

Author

Katzier, Helmut ; Reischl, Renate ; Pagnin, Peter

Author_Institution

Public Commun. Networks, Siemens AG, Munich, Germany

Volume

19

Issue

1

fYear

1996

fDate

2/1/1996 12:00:00 AM

Firstpage

3

Lastpage

6

Abstract

We present results obtained from a reliable SPICE model for SIPAC connectors. By means of typical measurement and simulation results, the reliability of the simulation model is demonstrated. All important electric characteristics of the connectors can be simulated by the SPICE-model, e.g., different time delays and characteristic impedances, transmission, and reflection characteristics and near-end and far-end crosstalk. There are no restrictions in the simulation concerning pin assignments. The comparison between simulation and measurement is very good up to a limit of f=3 GHz and a risetime of t_r>35 ps

Keywords

SPICE; crosstalk; electric connectors; printed circuit accessories; 3 GHz; 35 ps; SIPAC connectors; SPICE model; characteristic impedances; electric characteristics; far-end crosstalk; high-pincount board connectors; near-end crosstalk; reflection characteristics; simulation; time delays; transmission characteristics; Circuit simulation; Connectors; Coupling circuits; Crosstalk; Delay effects; Equivalent circuits; Impedance; Pins; SPICE; Signal design;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1070-9894

Type

jour

DOI

10.1109/96.486476

Filename

486476