DocumentCode
768083
Title
Efficient transient simulation of lossy packaging interconnects using moment-matching techniques
Author
Celik, Mustafa ; Cangellaris, Andreas C.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume
19
Issue
1
fYear
1996
fDate
2/1/1996 12:00:00 AM
Firstpage
64
Lastpage
73
Abstract
This paper introduces enhancements to moment-matching techniques for rapid time-domain computer simulation of packaging interconnect structures. New moment calculating methods are proposed to handle dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent, equivalent transmission line parameters, or scattering parameters. Computer simulations of pulse propagation in interconnects with frequency-dependent ohmic losses are used to demonstrate the validity and accuracy of the proposed methods
Keywords
S-parameters; circuit analysis computing; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; method of moments; transient analysis; discontinuities; dispersive lossy packaging interconnects; frequency-dependent equivalent transmission line parameters; junctions; moment-matching techniques; ohmic losses; pulse propagation; scattering parameters; time-domain computer simulation; transient simulation; transitions; Computational modeling; Computer simulation; Dispersion; Frequency; Packaging; Power system transients; Propagation losses; Time domain analysis; Transmission line discontinuities; Transmission line measurements;
fLanguage
English
Journal_Title
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1070-9894
Type
jour
DOI
10.1109/96.486486
Filename
486486
Link To Document