Title :
Mechanical response of PCB assemblies during infrared reflow soldering
Author :
Mittal, Sandeep ; Masada, Glenn Y. ; Bergman, Theodore L.
Author_Institution :
Dept. of Mech. Eng., Texas Univ., Austin, TX, USA
fDate :
3/1/1996 12:00:00 AM
Abstract :
A finite element structural model is developed to predict the thermomechanical behavior of printed circuit board (PCB) assemblies during infrared reflow soldering. Specifically, the model predicts the amount of board warpage, the effects of increased PCB assembly stiffness resulting from the solder joint formation, and the size of gaps generated at the module lead solder pad interface. In this paper, quantitative estimates of these process-induced variables are provided as well as a description of the approach used for the analyses
Keywords :
assembling; finite element analysis; printed circuit manufacture; reflow soldering; PCB assemblies; board warpage; finite element structural model; infrared reflow soldering; mechanical response; process-induced variables; solder joint formation; solder pad interface; stiffness; thermomechanical behavior; Assembly; Copper; Lead; Packaging; Printed circuits; Reflow soldering; Semiconductor device modeling; Temperature; Thermal stresses; Thermomechanical processes;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
